Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications -- from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
Thin films, strong adhesion characteristics, and reproducible results of ALD make it ideal for many research labs and large batch manufacturing environments.
The ability to produce thin films to exacting standards makes ALD a compelling solution for depositing high-quality films to challenging substrates, such as heterostructures, nanotubes, and organic semiconductors.
Many technologists and researchers are replacing older deposition techniques such as evaporation, sputtering, and chemical vapor deposition with ALD to take advantage of its unique ability to produce conformal coating in and around 3D objects in a highly consistent manner.